TDV Microcut

SKU: N/A

₹765.00 – ₹1,940.00

Categories: Interproximal, Orthodontics Tag: TDV

Description
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Description

Hack-saw frame designed to remove excesses from the interproximal area

Designed to removal excesses of composites, adhesives, cements and amalgams from the proximal area. Also indicated for Inlay and Onlay, laminated vaneers and stripping in orthodontic procedures.

Features and Benefits

– Device developed to adapt special components:

Saw Blade: – remove surplus material without damage the contact point

– thickness of only 0,05mm

Diamond Strip: – allows to perform the stripping in orthodontic procedures

– thickness of only 0,1mm

– Easy and Safe handling

– All components are autoclavable

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TDV Microcut

₹765.00 – ₹1,940.00

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